What is Selective nickel
Selective Nickel Plating is an electrochemical process used to deposit
nickel on almost any conductive material and virtually any type of surface
without immersing the part in a plating bath. It offers several significant
advantages over conventional plating processes, the most important of which is
the ability to deposit metal precisely onto the area where it is required, and
in varying and closely controlled uniform thicknesses. The deposits have
excellent adhesion, are dense fine grained, low in porosity and are deposited
without generating any damaging heat. The process can be used on single parts or
high volume production runs.
of selective plating is simple. The D.C. power pack (rectifier)
supplies a negative current to the work piece and a positive current to a hand
held, or in some cases, a fixtured electrode (anode). The anode is covered with an
absorbent material (ex. Scotch Brite, Cotton Dacron Sleeving) which holds the
plating solution. The anode is either dipped or
the plating solution is constantly pumped up to the area being
anode is then applied to the workpiece by the operator, or the workpiece moved
over a fixed anode. This movement will allow even
plating build-up on the entire area being plated. Plating occurs only where the
anode contacts the workpiece.
advantages of selective
Plating should be considered whenever industry builds up metal for repair or
resizing, or for mechanical or corrosion resistant properties. The plater can
take equipment used in brush plating to the work, often avoiding disassembly,
reassembly, and downtime. Brush plating, or selective plating as it is also
known, affords numerous benefits over other metal repair processes such as
welding, thermal spraying, or bath electroplating
Portability, the ability to move the equipment to the work rather than the work to outside venders.
Ease of operation.
Capability for very rapid nickel build-up
Disassembly of machinery/parts can be minimized.
Reduces the amount of masking required as with bath electroplating.
Permits plating of parts too large for normal plating tanks.
The ability to coat to size with little or no post machining in most cases.
Excellent adhesion to most base metals.
Minimization of hydrogen embrittlement.
The ability to add metal without thermal distortion.
Thickness control from 0.00001".
Touch-up of plated coatings without the need to strip and replate the entire part.
Reduces waste disposal problems since minimal volumes of waste are involved.
Compliance with most Federal (US) and Commercial Specifications.