World Class Services

World Class Staff

Utilizing the most talented staff, equipment, processes and supplier resources Semano Inc. satisfies customer's anodizing, chemical cleaning and selective nickel plating demands for quality, price, and delivery.

ServiceS provided by semano inc.

Semiconductor Anodizing:

  • Sulfuric (ACS Grade ACID): 0.1 to 5.0 Mils Thickness.
  • Oxalic (ACS Grade Crystals): 0.1 to 4.0 Mils Thickness. 

    Hard Anodizing:

  • Mil-A-8625 Type III, Class 1 , Class 2 (Black Dye).

    Sulfuric Anodizing:

  • Mil-A-8625 Type II, Class 1 , Class 2 (Black Dye).

    Oxalic Acid Anodizing:

  • Used for hard non-conductive surfacing of aluminum.  Meets Mil-A-8625

    Selective Anodizing:

  • Localized spot repair: Type II and Type III. Oxalic Coating.

    Hot Di Water Sealing:

  • Quantitative seal valve readouts.

    Nickel Acetate Sealing:

  • Quantitative seal valve readouts.

    Critical Masking:

  • Specialist anodizing and selective nickel masking.

    Teflon Coating:

  • Reduce Friction Coefficient.  AT-4000: Hard anodize with a bonded teflon coating.

    Electropolishing:

  • On Aluminum surfaces.

    Chemical Cleaning:

  • State of the art class 1000 clean room. 

    Selective Nickel Plating:

  • Meets Mil-Std-865C

    Chemical/Alodine Film:

  • Mil-C-5541 Alodine 600: Low electrical contact, corrosion resistance.

    Elecroless Nickel:

  • High Phosphorous, low particle and low stress.

    Mechanical Finishing:

  • Bead Blast 25, 50, 100 mm iron free pure aluminum oxide.  Graining lapping and sanding.  Rotary scotchbrite finishing and polishing.

    Ultrasonic Rinsing:

  • Varible power, counterflow ultrsonic rinsing with water quality Mohn water atr elevated temperature.

    Technical Support:

  • Offered to customers and OEM engineering and production.  Print review, anodizing/nickel requirement review.  Quality assurance coordination.  Design of experiments (DOE).  Specification writing.

    Customer Support:

  • Quick turnaround with having multiple processes in one facility.  Computerized scheduling and ramping capabilities.